Functions:
| Type | Content |
| Name | Chip Test Burning All-in-one Machine |
| Application | Semiconductor packaging testing |
| Equipment size | 2200*1300*1800mm（L*W*H） |
| Loading method | Manual feeding |
| Applicable materials | QFP/QFN/BGA/SOP/PLCC |
| Applicable vehicles | Tray disc, tubular |
| UPH | 10000pcs |
| Vision system | Polarity detection, character detection, Socket localization |
| Repetitive accuracy | ±0.02mm |
| Function | Real time alarm, real-time monitoring, MES system, character detection |
Technical Advantages:
★ One feed pipe, one OK discharge pipe, and one FALL discharge pipe, driven by an electromagnet to sort the edges to the OK/FAIL pipe;
★ There are three modes to choose from: automatic, OK test, and FAIL test;
★ There are debugging and pause modes, respectively used for machine maintenance and temporary removal of stuck materials;
★ The full number of discharge pipes can be freely set by the customer;
★ FAIL materials can be retested by the user's set number of times;
★ The interface signal high and low levels of the testing machine can be set by the user;
★ When there is a mechanical abnormality, the LED displays the abnormality code, making it convenient for users to troubleshoot;
★ Can display the number and total number of tests for OK/FAIL materials;
★ High speed test: 2000UPH;
